Printed circuit board and component warpage during reflow and operation is a major source of manufacturing yield and field reliability problems. InterCAX offers tools and services for thermo-mechanical warpage simulation of electronic products, based on original technology from Georgia Tech:

• Automated warpage simulation tools
  • Bare board stackup design and warpage analysis
  • Assembled board warpage analysis
  • Chip package warpage analysis
• Use of rich product models to drive high-fidelity analyses
• Standards-based interfaces to most ECAD tools, including Cadence, Mentor Graphics, and Zuken
• Collaboration opportunities
  • Georgia Tech research project
  • Test cases

InterCAX works frequently with AkroMetrix LLC, the leading supplier of flatness measurement systems for electronic manufacturing, to provide complementary experimental and simulation results for model validation and design variable exploration. Contact AkroMetrix or InterCAX for further information.

Warpage represents only one example of InterCAX technology on design-analysis integration - extracting, completing, transforming design information to automate and expedite electronic, mechanical, and thermal simulations.

Contact InterCAX for further information.